Detail Specification

Semi-Auto Vacuum Wafer 

• Effective for bumped or structured wafers/substrates and for thin or brittle wafers.
• No mechanical contact with substrate – eliminates wafer stress during mounting.
• Vacuum mounting environment –eliminates air bubbles. 
• Automatic (PLC-controlled) wafer mounting process, manual tape handling.
• Process-controlled tape tensioning.
• Simple-to-use, touch screen operator interface.
• Built-in vacuum generator.