Products & Service
8350series
Detail Specification
Main Specification
| Bonding Method | Epoxy / DAF |
| Bonding Speed | Flip / Flux : 0.6sec/pc |
| Bonding Accuracy | X-Y : ± 25μm θ : ±1.0° |
| Bonding Area | X : 30mm Y : 100mm |
| Direct/ Flip Bonding | Flip / Direct |
| Bonding Weight | 30~200g |
| Chip Size | 0.3~5mm |
| Lead frame size |
Length : 90mm~300mm Width : 30mm~100mm Thickness : 0.1~1.5mm |
| Wafer Size | 8"/12" Flat ring |
| Basic OS | Windows 7 |