Products & Service
DCA1000
DCA1000
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Clip Bonder series
Clip Bond Line for High Power Package
1.Solder Coated Chip Bonding
2.Solder Ribbon Dispensing
3.Clip Bonding
4.Post Bond Stage and Defect Unit Cutter
*Chip & Clip are from Parts Feeder
Detail Specification
| Process |
Solder Coated Chip Bonding Soler Ribbon Bond & Clip Bond Post Bond Inspection and Reject Cutter |
| Chip Size | □ 0.1~6.0mm+ |
| Lead Frame Width | ~30mm |
| Machine Cycle Time |
0.9sec (1chip) 1.6sec (2chip) |
| Chip and Clip | Parts Feeder Supply |
| Overall Size | 2,300x1,000x1, 490mm |
| Mass | 1,200kg |