Products & Service
3580series
3580series
-
Flux-free Soft Solder Bonding for Power Semiconductor
and Modules
Featuring Max100mm width capability
And Solder Line Dispense for Large Die
Detail Specification
Option
- Self-alignment spanker for Large die
- Epoxy Dispensing
- Gripper Loader System
- Magazine Loader
- Auto Wafer Changer
- 12" Wafer Capability(8500series)
| L/F | Strip or Reel |
| Process | Solder or Epoxy |
| Chip Size | □1.0~8.0mm(Option:~14.0mm) |
| Bond Weight | 0.3~3.0N(30gf~300gf) |
| Accuracy | +/-35μm, +/-3°@cp1.33 |
| BLT | 1~3mils |
| L/F Width | 15~100mm |
| L/F Length | 150~300mm |
| Wafer Size | Max. 8inch(Max.12inch=8500) |
| Auto Wafer Loader | Option |