Products & Service
4350series
4350series
-
Epoxy Die Bonder for Fast-Dry Epoxy
Featuring Die Attach Film Bonding Capability
Detail Specification
Option
- Rotary bond head for theta control
- Post Bond Inspection
- Up Looking Camera
- Up/Down Unit for non-flat L/F
- Magazine Loader
- Auto Wafer Changer
- Wafer Mapping(Inkless Die Attach)
- Advanced Process Control with SECS/GEM
| L/F | Strip |
| Process | Epoxy and/or DAF |
| Chip Size | □0.15~3.0mm |
| Bond Weight | 0.3~2.0N(30gf~200gf) |
| Accuracy | +/-15μm, +/-3°@cp1.33*with up looking camera |
| L/F Width | Max.75mm |
| Wafer Size | Max. 8inch |
| Auto Wafer Loader | Option |