Products & Service
4600series
4600series
-
Best solution for High Density Product(Leadless,CSP)
manufacturing by eutectic / epoxy co-use system
Detail Specification
Option
- Rotary Bond head for theta conreol
- Mechanical Clamp(Normal:Vac. Clamp)
- Post Bond Inspection
- Up Looking Camera
- Dual Dispenser, Flux Dipping Unit
- Gripper Index for Epoxy (Normal:Pin Index)
- Magazine Loader
- Auto Wafer Changer
- Full Cover with HEPA Filter
- Wafer Mapping(Inkless Die Attach)
- Advanced Process Control with SECS/GEM
- Strip Map
| L/F | Strip |
| Process | Eutectic and/or Epoxy |
| Chip Size |
□0.2~1.0mm(Eutectic)~3.0mm(Epoxy) |
| Bond Weight | 0.3~3.0N(30gf~300gf) |
| Accuracy | +/-15μm, +/-3°@cp1.33*with up looking camera |
| L/F Width | Max.75mm |
| Wafer Size | Max. 8inch |
| Auto Wafer Loader |
Option In case of Mag. To Mag. |