Products & Service
4200series
4200series
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The Best solution for RTP processing
L/F based discrete package like SOT23, SC-75 and others
Featuring small die capability(□6mils~)
Detail Specification
Option
- Rotary bond head for theta control
- Post Bond Inspection
- Wafer mapping(Inkless Die Attach)
- Epoxy Dispensing/Stamping
- Dual Dispenser
- Nozzle Cleaner, Dummy Dot Station
- In-Line System for better productivity
- Blow & Suction Unit
- Reject Chip Remover
| L/F | Reel |
| Process | Eutectic and/or Epoxy |
| Chip Size | □0.15~1.0mm(6mils~) |
| Bond Weight | 0.3~3.0N(30gf~300gf) |
| Accuracy | +/-25μm, +/-3°@cp1.33 |
| L/F Width | Max.76mm |
| Wafer Size | Max. 8inch |
| Auto Wafer Loader | Option |