產品及服務介紹

PRODUCTS & SERVICE

產品及服務介紹

MC100

MC100

    特性說明:

    Annealsys MC100為一100mm DLI-CVD and DLI-ALD薄膜沉積製程系統提供材料研究開發多方面應用。

    Direct Liquid Injection (DLI)汽化器提供先驅物(precursors)良好的控制並可使用低壓與稀釋的化學先驅物。汽化先驅物可由旁通閥快速切換提供薄膜沉積物良好的控制。

    反應腔熱控制壁提供先驅物更有效地使用,並可限制薄膜沉積物於製程腔體壁上生成。自動液體流量控制板可自動調整先驅物的使用量而使之最佳化。無死角的容器設計提供化學品更快速地更換與填充。

馬上詢價!

詳細說明

規格表格:

 

Maximum substrate diameter

4-inch

Process chamber

Stainless steel with thermally controlled walls

Rotating substrate holder

Heating

Resistor heating up to 850°C

Temperature control

Thermocouple temperature control

Digital PID temperature controllers

Vacuum, gas and liquid

Up to 8 process gas lines with mass flow controllers

Up to 4 vaporizer units selected function of liquid precursors

Additional ALD kit for water

Automated liquid panel for easy precursor handling

Vacuum valve, vacuum gauge and purge gas line

By-pass vacuum valve

Pressure control with throttle valve

Optional vacuum rotary pump

Control

Full PC control

Facilities

Electricity: 3x400V+N+Gr or 3x220V+Gr, 50/60 Hz

Power: 12 kW

Water: 2 to 6 bars, pressure drop 1 bar, 4 l/mn

Compressed air: 6 bars (valve actuation)

Process gas fittings: Swagelok ¼ (VCR ¼ optional)

Dimensions and weight

Width: 1100 mm

Depth: 1450 mm

Height: 2000 mm

Weight: 800 kg

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 


  • Implant annealing
  • Contact annealing (III-V and SiC)
  • Rapid Thermal Oxidation (RTO)
  • Rapid Thermal Nitridation (RTN)
  • Selenization (CIGS solar cells)
  • Silicon carbonization
  • Sol-gel densification and crystallization
  • Diffusion from spin-on dopants
  •  
  • Simple and multi-metallic oxides
  • Metals, nitrides and alloys
  • III-V, wide band gap semiconductors
  • 2D and 3D materials
  • hBN, MoS2, WS2, MoSe2, WSe2, Graphene
  •  
  • SiC implant annealing
  • CVD of graphene
  • Graphene by high temperature SiC sublimation

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