詳細說明

Main Specification

 

Bonding Method	Epoxy / DAF
Bonding Speed	Flip / Flux : 0.6sec/pc
Bonding Accuracy	X-Y : ± 25μm θ : ±1.0°
Bonding Area	X : 30mm Y : 100mm
Direct/ Flip Bonding	Flip / Direct
Bonding Weight	30~200g
Chip Size	0.3~5mm
Lead frame size	Length : 90mm~300mm Width : 30mm~100mm Thickness : 0.1~1.5mm
Wafer Size	8"/12" Flat ring
Basic OS	Windows 7

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

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• Epoxy / DAF
• Flip/Chip