產品及服務介紹
DCA1000
DCA1000
-
Clip Bonder series
Clip Bond Line for High Power Package
1.Solder Coated Chip Bonding
2.Solder Ribbon Dispensing
3.Clip Bonding
4.Post Bond Stage and Defect Unit Cutter
*Chip & Clip are from Parts Feeder
詳細說明
| Process |
Solder Coated Chip Bonding Soler Ribbon Bond & Clip Bond Post Bond Inspection and Reject Cutter |
| Chip Size | □ 0.1~6.0mm+ |
| Lead Frame Width | ~30mm |
| Machine Cycle Time |
0.9sec (1chip) 1.6sec (2chip) |
| Chip and Clip | Parts Feeder Supply |
| Overall Size | 2,300x1,000x1,490mm |
| Mass | 1,200kg |
- Solder
- Solder coated chip
- Clip Bonding
- Soler Ribbon Bond
- High Power Package