詳細說明

Option

• Self-alignment spanker for Large die
• Epoxy Dispensing
• Gripper Loader System
• Magazine Loader
• Auto Wafer Changer
• 12" Wafer Capability(8500series)

L/F	Strip or Reel
Process	Solder or Epoxy
Chip Size	□1.0~8.0mm(Option:~14.0mm)
Bond Weight	0.3~3.0N(30gf~300gf)
Accuracy	+/-35μm, +/-3°@cp1.33
BLT	1~3mils
L/F Width	15~100mm
L/F Length	150~300mm
Wafer Size	Max. 8inch(Max.12inch=8500)
Auto Wafer Loader	Option

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

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• Soft Solder
• Solder or Epoxy
• Switching Powe Supply IC
• Power MOSFET
• Power Management IC
• IGBT Chip and Module