詳細說明

Option

• Rotary bond head for theta control
• Post Bond Inspection
• Up Looking Camera
• Up/Down Unit for non-flat L/F
• Magazine Loader
• Auto Wafer Changer
• Wafer Mapping(Inkless Die Attach)
• Advanced Process Control with SECS/GEM

L/F	Strip
Process	Epoxy and/or DAF
Chip Size	□0.15~3.0mm
Bond Weight	0.3~2.0N(30gf~200gf)
Accuracy	+/-15μm, +/-3°@cp1.33*with up looking camera
L/F Width	Max.75mm
Wafer Size	Max. 8inch
Auto Wafer Loader	Option

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

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• Epoxy / DAF
• Wafer Mapping
• Epoxy Die Bonder
• Power Management IC