詳細說明

Option

• Rotary Bond head for theta conreol
• Mechanical Clamp(Normal:Vac. Clamp)
• Post Bond Inspection
• Up Looking Camera
• Dual Dispenser, Flux Dipping Unit
• Gripper Index for Epoxy (Normal:Pin Index)
• Magazine Loader
• Auto Wafer Changer
• Full Cover with HEPA Filter
• Wafer Mapping(Inkless Die Attach)
• Advanced Process Control with SECS/GEM
• Strip Map

L/F	Strip
Process	Eutectic and/or Epoxy
Chip Size	□  0.2~1.0mm (Eutectic) ~3.0mm(Epoxy)
Bond Weight	0.3~3.0N(30gf~300gf)
Accuracy	+/-15μm, +/-3°@cp1.33*with up looking camera
L/F Width	Max.75mm
Wafer Size	Max. 8inch
Auto Wafer Loader	Option In case of Mag. To Mag.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

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• Leadless, CSP
• eutectic / epoxy co-use system
• Wafer Mapping
• Power MOSFET
• Battery protection IC
• Diode