詳細說明

Option

• Rotary bond head for theta control
• Post Bond Inspection
• Wafer mapping(Inkless Die Attach)
• Epoxy Dispensing/Stamping
• Dual Dispenser
• Nozzle Cleaner, Dummy Dot Station
• In-Line System for better productivity
• Blow & Suction Unit
• Reject Chip Remover

L/F	Reel
Process	Eutectic and/or Epoxy
Chip Size	□0.15~1.0mm(6mils~)
Bond Weight	0.3~3.0N(30gf~300gf)
Accuracy	+/-25μm, +/-3°@cp1.33
L/F Width	Max.76mm
Wafer Size	Max. 8inch
Auto Wafer Loader	Option

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

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• Wafer mapping
• Diode
• Eutectic / Epoxy
• Discrete package