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產品及服務介紹

SprayCVD-050

SprayCVD-050

    特性說明:

    ANNEALSYS SprayCVD-050為2"氣溶膠CVD反應器,特別適用於研發單位

    - 此系統可適用於最大2”x2”大小的基板

    - 紅外線燈管加熱系統提供製程腔內反應同時的快速升溫製程

    - 可搭配Kemstream Atokit 以進行前驅物的霧化

    - 具抽真空及氣體混合功能

    - 完全電腦化控制以方便使用及資料存取

    - 軟體與Windows系統相容

馬上詢價!

詳細說明

規格表格:

 

Applications Spray-CVD, RTA, RTO, In-situ annealing capability
Substrate size up to 2-inch diameter
Temperature max. 1200°C
Temperature ramp rate 200°C/s on 2-inch silicon wafer
Temperature control thermocouple (optional pyrometer) , fast PID
Vacuum capability 10-3 Torr
Gas lines up to 3 gas lines with MFC and one purge line with needle valve
Loading manual, optional interface for glove-box

 

Maximum substrate size

   2-inch x 2-inch

Process chamber 

   Quartz tube with stainless steel flanges

Heating

   Halogen lamps

   Optional top or/and bottom source heating

Temperature control

   Thermocouple temperature control

   Fast digital PID temperature controller

Vacuum, gas and liquid   

   Purge gas line with needle valve

   Up to 3 process gas lines with mass flow controllers

   Kemstream Atokit for precursor atomization

   Vacuum valve and vacuum gauge

   Optional vacuum rotary pump

   Optional pressure control with throttle valve

Control

   Full PC control

Facilities

   Electricity: 3x400V+N+Gr or 3x220V+Gr, 50/60 Hz

   Power: 15 kW

   Water: 2 to 6 bars, pressure drop 1 bar, 8 l/mn

   Compressed air: 6 bars (valve actuation, low consumption)

   Process gas fittings: Swagelok ¼

Dimensions and weight

   Width: 700 mm

   Depth: 700 mm

   Height: 700 mm

   Weight: 90 kg

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 


  • Implant annealing
  • Contact annealing (III-V and SiC)
  • Rapid Thermal Oxidation (RTO)
  • Rapid Thermal Nitridation (RTN)
  • Selenization (CIGS solar cells)
  • Silicon carbonization
  • Sol-gel densification and crystallization
  • Diffusion from spin-on dopants
  •  
  • Simple and multi-metallic oxides
  • Metals, nitrides and alloys
  • III-V, wide band gap semiconductors
  • 2D and 3D materials
  • hBN, MoS2, WS2, MoSe2, WSe2, Graphene
  •  
  • SiC implant annealing
  • CVD of graphene
  • Graphene by high temperature SiC sublimation

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