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產品及服務介紹

MC050

MC050

    特性說明:

    Annealsys MC050為一2”多功能薄膜沉積製程系統(DLI-CVD, DLI-ALD, MOCVD, RTP and RTCVD),提供廣泛地新材料開發研究。

    Direct Liquid Injection (DLI)汽化器提供先驅物(precursors)良好的控制並可使用低壓與稀釋的化學先驅物。汽化先驅物可由旁通閥快速切換提供薄膜沉積物良好的控制。

    製程腔體燈源加熱系統可在薄膜沉積製程前後直接做退火製程。自動液體流量控制板可自動調整先驅物的使用量而使之最佳化。無死角的容器設計提供化學品更快速地更換與填充。

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詳細說明

 

Maximum substrate diameter

2-inch (51 mm)

Process chamber

Quartz tube with water-cooled stainless steel flanges

Heating

Halogen lamps

Temperature control

Thermocouple temperature control

 

 

Optional pyrometer temperature control

Digital PID temperature controllers

Vacuum, gas and liquid

 

Up to 8 process gas lines with mass flow controllers

Up to 6 vaporizer units selected function of liquid precursors

Additional ALD kit for water

Automated liquid panel for easy precursor handling

Vacuum valve, vacuum gauge and purge gas line

By-pass vacuum valve

Pressure control with throttle valve

Optional vacuum rotary pump

Optional turbo pump

Control

Full PC control

Facilities

Electricity: 3x400V+N+Gr or 3x220V+Gr, 50/60 Hz

Power: 20 kW

Water: 2 to 6 bars, pressure drop 1 bar, 8 l/mn

Compressed air: 6 bars (valve actuation)

Process gas fittings: Swagelok ¼ (Optional VCR)

Dimensions and weight

Width: 955 mm

Depth: 1604 mm

Height: 1812 mm

Weight: 400 kg

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 


  • Implant annealing
  • Contact annealing (III-V and SiC)
  • Rapid Thermal Oxidation (RTO)
  • Rapid Thermal Nitridation (RTN)
  • Selenization (CIGS solar cells)
  • Silicon carbonization
  • Sol-gel densification and crystallization
  • Diffusion from spin-on dopants
  •  
  • Simple and multi-metallic oxides
  • Metals, nitrides and alloys
  • III-V, wide band gap semiconductors
  • 2D and 3D materials
  • hBN, MoS2, WS2, MoSe2, WSe2, Graphene
  •  
  • SiC implant annealing
  • CVD of graphene
  • Graphene by high temperature SiC sublimation

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